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9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

9504 TDS-EN.pdf   9504 One-Component Pre-Curing Type Thermal Gel, which has   no residual stress after sizing, effectively protects precision electronic components from damage     Product Description   Pink paste gel One-part pre-curing type Silicone thermal conductivity complex     Product Features:   High thermal conductivity 4W/m∙K Very small BLT and very low thermal resistance Soft adhesion and self-adhesive properties after dispensing Excellent chemical and mechanical stability No residual stress after sizing, effectively protects precision electronic components from damage   Technical Parameters Reference standard Item Unit Value GB/T 13354 Density g/cm 3 3.2 -- Extrusion rate (30ccEFD@90psi) g/min 30 ISO22007 Thermal conductivity W/ m·K 4.0 GB/T2408 Flame retardant / V0 GB/T2408 Volume resistivity Ω·cm ≥1.0×10 13 ASTM D149 Dielectric strength Kv/ mm 8.0 ASTM D5470 Minimum thickness mm 0.1   Main Applications: Bare die chip low-stress mounting Heat dissipation field of 5G communication boards Automotive electronic equipment Smart phone modules and consumer-electronics Other high-value boards need to be reworked   Packing: 30cc/tube; 300cc/tube   Storage: Store below 35°C in a cool and dry place. Shelf life is 6 months.    
Jakość 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics fabryka

9506 One Component Pre Curing Type Thermal Gel Pre Curing System For Easy Dispensing

9506 TDS-EN.pdf   9506 One-Component Pre-Curing Type Thermal Ge l,  which has excellent chemical and mechanical stability.   Product Description One-part silicone thermal conductive gel Blue paste Pre-curing type   Product Features: Thermal conductivity: 6.0 W/ m·K Pre-curing system for easy dispensing Excellent chemical and mechanical stability No residual stress after gluing, effectively protects precision electronic components from damage   Technical Parameters Reference standard Item Unit Value ASTM D792 Density g/cm 3 3.3±0.3 Huitian test method Flow velocity (30cc EFD/ 90psi/60s) g/min 30 ASTM D257 Volume resistivity Ω·cm 1.0×10 12 ASTM D149 Dielectric strength Kv/mm 4 ISO22007 Thermal conductivity W/ m·K 6.0±10%   Operating temperature ℃ -40~150   Main Applications: Bare die chip low-stress mounting environment 5G communication board cooling field High-value boards need to be reworked Smart phone modules and consumer electronics etc   Packing: 30cc/tube; 300cc/cartridge   Storage: Store at 8-25°C in a cool and dry place. Shelf life is 6 months.    
Jakość 9506 One Component Pre Curing Type Thermal Gel Pre Curing System For Easy Dispensing fabryka

5272 Two Component Thermal Gel Gap Filler Working Temperature Range -40℃~200℃ Excellent Insulation Performance

5272 TDS-EN.pdf   5272 is a two-component room-temperature curing silicone gel, that has high thermal conductivity and low density, good weather resistance, and aging resistance.   Product Description Two-component room-temperature curing silicone gel 1:1 heat curing     Product Features: High thermal conductivity Excellent insulation properties Good weather and aging resistance Flame retardant grade: up to UL94V-0 Working temperature: -40°C~200°C RoHS Directive     Technical Parameters Reference standard Item Unit Value Properties before curing (25±2 ℃ , 60±5%RH) Q/HTXC 2 Appearance (A) -- White paste   Appearance (B) -- Blue paste GB/T 2794 Viscosity (A) Pa·s 80-160   Viscosity (B) Pa·s 80-160 GB/T13354 Density (A) g/cm 3 2.8±0.1   Density (B) g/cm 3 2.8±0.1 Curing properties ( A:B=1:1 ) Q/HTXC 2 Curing time (80℃) min 30 Q/HTXC 2 Initial curing time (25℃) min 240 Properties after curing (25±2 ℃ , 60±5%RH) GB/T531 Hardness Shore 00 40~60 ASTM D149 Dielectric strength KV/mm 7 ASTM D150 Dielectric constant / 5 ISO 22007 Thermal conductivity W/m·K 2.5±10% US EPA8270E D3-D10 Ppm ＜1,000   Main Applications:   New energy vehicle lithium battery Automobile electronic equipment Large storage devices Communication equipment board   Packing: 350ml/cartridge; 25kg/barrel   Storage: Store at 8-25°C in a cool and dry place. Shelf life is 6 months.    
Jakość 5272 Two Component Thermal Gel Gap Filler Working Temperature Range -40℃~200℃ Excellent Insulation Performance fabryka

5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature

5274 TDS-EN.pdf   5274 i s  a two-component silicone thermal conductive ge l, which be able to cure at room temperature or accelerate curing at high temperature   Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two components     Product Features: Thermal conductivity: 4.0 W/m∙K Excellent workability Curing at room temperature or accelerated curing  at high temperature Low static/transient stress on substrates High reliability under various conditions     Technical Parameters Standards Items Unit Values Visual Appearance (A/B) - Blue/white ASTM D792 Density (A/B) g/ml 3.2/3.2 / Mix ratio - 1 :1 (W/W) ASTM D2196 Viscosity Pa·s 250 ±100 ASTM D5470 Thermal conductivity W/(m·K) 4.0 ASTM D5470 Thermal Impedance ℃·cm2 /W 0.43 ASTM D257 Volume resistivity   Ω·cm 1.0×10 12 ASTM D149 Dielectric strength KV/m 15 UL94 Flame rating - V-0 ∕ Operating temperature ℃ -40-200 ∕ Operating time @ 25℃ min ＞60 / Cure time @ 25℃ h 8 ∕ Cure time@120℃ min 20   Main Applications: Heat dissipation of lithium battery packs in new energy vehicles Heat dissipation of battery packs in energy storage power stations Automotive electronic equipment Large storage devices Communication equipment   Packing: 400ml/cartridge; 25kg/barrel; 298kg/drum   Storage: Store at 8-25°C in a cool and dry place. Shelf life is 6 months.    
Jakość 5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature fabryka

5270 Two Component Thermal Gel Gap Filler Low Viscosity And Good Workability Able To Cure At Room Temperature

5270 TDS-EN.pdf   5270 i s  a two-component silicone thermal conductive gel, which has h igh thermal conductivity and low density   Product Description   Silicone thermal conductive two-component gel Low transient/static stress Two-part 1: 1 mix     Product Features:   Thermal conductivity: 2.0 W/m∙K Can be cured at room temperature or accelerated at high temperature Low viscosity and good operability High reliability under various aging conditions     Technical Parameters Standards Items Unit Values Visual Appearance (A/B) - White/Green ASTM D792 Density (A/B) g/ml 2.1/2.1 / Mix ratio - 1 :1 (W/W) ASTM D2196 Viscosity mPa·s 250,000 ASTM D5470 Thermal conductivity W/(m·K) 2.0 ASTM D2240 Hardness after curing Shore00 50 ASTM D257 Volume resistivity   Ω·cm 1.0×10 1 2 ASTM D149 Dielectric strength KV/m 12 UL94 Flame rating - V-0 ∕ Operating temperature ℃ -40-150 ∕ Operating time @ 25℃ min 120 / Cure time @ 25℃ h 24 ∕ Cure time @120℃ min 20   Main Applications:   New energy vehicle lithium battery Automobile electronic equipment Large storage devices Communication equipment board   Packing: 30cc/tube; 400cc/cartridge   Storage: Store at 8-25°C in a cool and dry place. Shelf life is 6 months.    
Jakość 5270 Two Component Thermal Gel Gap Filler Low Viscosity And Good Workability Able To Cure At Room Temperature fabryka

9503 One-Component Pre-Curing Type Thermal Gel High Power LED And Other Applications Requiring Heat Dissipation

9503 TDS-EN.pdf   9503 One-Component Pre-Curing Type Thermal Gel, which has  h igh thermal conductivity and high thixotropy.   Product Description Blue Cement Pre-curing type Self-adhesive   Product Features: High thermal conductivity, high thixotropy Excellent weather and aging resistance Working temperature -40-150℃ RoHS Directive   Technical Parameters Reference standard Item Unit Value GB/T 13354 Density g/cm 3 2.0-2.2 Q/HTXC 1 Flow velocity g/min 20-40 ISO22007 Thermal conductivity W/ m·K 2.0±10% GB/T2408 Flame retardant / V0 GB/T2408 Volume resistivity Ω·cm ≥1.0×10 12 ASTM D149 Dielectric strength Kv/ mm ≥5 ASTM D5470 Minimum thickness mm 0.12   Main Applications: Heat dissipation in new energy vehicle cells and modules; electronic components, flip-chips, transformers, high-power LEDs, and other applications with similar heat dissipation needs   Packing: 650g/tube   Storage: Store below 35°C in a cool and dry place. Shelf life is 6 months.    
Jakość 9503 One-Component Pre-Curing Type Thermal Gel High Power LED And Other Applications Requiring Heat Dissipation fabryka
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9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

9504 TDS-EN.pdf   9504 One-Component Pre-Curing Type Thermal Gel, which has   no residual stress after sizing, effectively protects precision electronic components from damage     Product Description   Pink paste gel One-part pre-curing type Silicone thermal conductivity complex     Product Features:   High thermal conductivity 4W/m∙K Very small BLT and very low thermal resistance Soft adhesion and self-adhesive properties after dispensing Excellent chemical and mechanical stability No residual stress after sizing, effectively protects precision electronic components from damage   Technical Parameters Reference standard Item Unit Value GB/T 13354 Density g/cm 3 3.2 -- Extrusion rate (30ccEFD@90psi) g/min 30 ISO22007 Thermal conductivity W/ m·K 4.0 GB/T2408 Flame retardant / V0 GB/T2408 Volume resistivity Ω·cm ≥1.0×10 13 ASTM D149 Dielectric strength Kv/ mm 8.0 ASTM D5470 Minimum thickness mm 0.1   Main Applications: Bare die chip low-stress mounting Heat dissipation field of 5G communication boards Automotive electronic equipment Smart phone modules and consumer-electronics Other high-value boards need to be reworked   Packing: 30cc/tube; 300cc/tube   Storage: Store below 35°C in a cool and dry place. Shelf life is 6 months.    
Jakość 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics fabryka

9506 One Component Pre Curing Type Thermal Gel Pre Curing System For Easy Dispensing

9506 TDS-EN.pdf   9506 One-Component Pre-Curing Type Thermal Ge l,  which has excellent chemical and mechanical stability.   Product Description One-part silicone thermal conductive gel Blue paste Pre-curing type   Product Features: Thermal conductivity: 6.0 W/ m·K Pre-curing system for easy dispensing Excellent chemical and mechanical stability No residual stress after gluing, effectively protects precision electronic components from damage   Technical Parameters Reference standard Item Unit Value ASTM D792 Density g/cm 3 3.3±0.3 Huitian test method Flow velocity (30cc EFD/ 90psi/60s) g/min 30 ASTM D257 Volume resistivity Ω·cm 1.0×10 12 ASTM D149 Dielectric strength Kv/mm 4 ISO22007 Thermal conductivity W/ m·K 6.0±10%   Operating temperature ℃ -40~150   Main Applications: Bare die chip low-stress mounting environment 5G communication board cooling field High-value boards need to be reworked Smart phone modules and consumer electronics etc   Packing: 30cc/tube; 300cc/cartridge   Storage: Store at 8-25°C in a cool and dry place. Shelf life is 6 months.    
Jakość 9506 One Component Pre Curing Type Thermal Gel Pre Curing System For Easy Dispensing fabryka

5272 Two Component Thermal Gel Gap Filler Working Temperature Range -40℃~200℃ Excellent Insulation Performance

5272 TDS-EN.pdf   5272 is a two-component room-temperature curing silicone gel, that has high thermal conductivity and low density, good weather resistance, and aging resistance.   Product Description Two-component room-temperature curing silicone gel 1:1 heat curing     Product Features: High thermal conductivity Excellent insulation properties Good weather and aging resistance Flame retardant grade: up to UL94V-0 Working temperature: -40°C~200°C RoHS Directive     Technical Parameters Reference standard Item Unit Value Properties before curing (25±2 ℃ , 60±5%RH) Q/HTXC 2 Appearance (A) -- White paste   Appearance (B) -- Blue paste GB/T 2794 Viscosity (A) Pa·s 80-160   Viscosity (B) Pa·s 80-160 GB/T13354 Density (A) g/cm 3 2.8±0.1   Density (B) g/cm 3 2.8±0.1 Curing properties ( A:B=1:1 ) Q/HTXC 2 Curing time (80℃) min 30 Q/HTXC 2 Initial curing time (25℃) min 240 Properties after curing (25±2 ℃ , 60±5%RH) GB/T531 Hardness Shore 00 40~60 ASTM D149 Dielectric strength KV/mm 7 ASTM D150 Dielectric constant / 5 ISO 22007 Thermal conductivity W/m·K 2.5±10% US EPA8270E D3-D10 Ppm ＜1,000   Main Applications:   New energy vehicle lithium battery Automobile electronic equipment Large storage devices Communication equipment board   Packing: 350ml/cartridge; 25kg/barrel   Storage: Store at 8-25°C in a cool and dry place. Shelf life is 6 months.    
Jakość 5272 Two Component Thermal Gel Gap Filler Working Temperature Range -40℃~200℃ Excellent Insulation Performance fabryka

5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature

5274 TDS-EN.pdf   5274 i s  a two-component silicone thermal conductive ge l, which be able to cure at room temperature or accelerate curing at high temperature   Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two components     Product Features: Thermal conductivity: 4.0 W/m∙K Excellent workability Curing at room temperature or accelerated curing  at high temperature Low static/transient stress on substrates High reliability under various conditions     Technical Parameters Standards Items Unit Values Visual Appearance (A/B) - Blue/white ASTM D792 Density (A/B) g/ml 3.2/3.2 / Mix ratio - 1 :1 (W/W) ASTM D2196 Viscosity Pa·s 250 ±100 ASTM D5470 Thermal conductivity W/(m·K) 4.0 ASTM D5470 Thermal Impedance ℃·cm2 /W 0.43 ASTM D257 Volume resistivity   Ω·cm 1.0×10 12 ASTM D149 Dielectric strength KV/m 15 UL94 Flame rating - V-0 ∕ Operating temperature ℃ -40-200 ∕ Operating time @ 25℃ min ＞60 / Cure time @ 25℃ h 8 ∕ Cure time@120℃ min 20   Main Applications: Heat dissipation of lithium battery packs in new energy vehicles Heat dissipation of battery packs in energy storage power stations Automotive electronic equipment Large storage devices Communication equipment   Packing: 400ml/cartridge; 25kg/barrel; 298kg/drum   Storage: Store at 8-25°C in a cool and dry place. Shelf life is 6 months.    
Jakość 5274 Two Component Thermal Gel Gap Filler Able To Cure At Room Temperature Or Accelerate Curing At High Temperature fabryka

5270 Two Component Thermal Gel Gap Filler Low Viscosity And Good Workability Able To Cure At Room Temperature

5270 TDS-EN.pdf   5270 i s  a two-component silicone thermal conductive gel, which has h igh thermal conductivity and low density   Product Description   Silicone thermal conductive two-component gel Low transient/static stress Two-part 1: 1 mix     Product Features:   Thermal conductivity: 2.0 W/m∙K Can be cured at room temperature or accelerated at high temperature Low viscosity and good operability High reliability under various aging conditions     Technical Parameters Standards Items Unit Values Visual Appearance (A/B) - White/Green ASTM D792 Density (A/B) g/ml 2.1/2.1 / Mix ratio - 1 :1 (W/W) ASTM D2196 Viscosity mPa·s 250,000 ASTM D5470 Thermal conductivity W/(m·K) 2.0 ASTM D2240 Hardness after curing Shore00 50 ASTM D257 Volume resistivity   Ω·cm 1.0×10 1 2 ASTM D149 Dielectric strength KV/m 12 UL94 Flame rating - V-0 ∕ Operating temperature ℃ -40-150 ∕ Operating time @ 25℃ min 120 / Cure time @ 25℃ h 24 ∕ Cure time @120℃ min 20   Main Applications:   New energy vehicle lithium battery Automobile electronic equipment Large storage devices Communication equipment board   Packing: 30cc/tube; 400cc/cartridge   Storage: Store at 8-25°C in a cool and dry place. Shelf life is 6 months.    
Jakość 5270 Two Component Thermal Gel Gap Filler Low Viscosity And Good Workability Able To Cure At Room Temperature fabryka
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251, Wenji Road, dystrykt Songjiang, Szanghaj Chiny E-mail: zhangsong@huitian.net.cn Tel: 15821230089 Tel: 15821230089
Największy dostawca klejów do badań i rozwoju oraz produkcji w Chinach
8615821230089
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